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 Career Technology
(MFG.) Co., Ltd. was incorporated in 1992 to manufacture a
comprehensive range of flexible printed circuits ( FPCs )
including single and double sided, single sided / double access,
multi-layered, flex / rigid and bend-flex circuits.
Besides manufacturing
FPCs, we offer support at the design level; from circuits design
to components assemblies on flex and functional testings. Our many
years of experiences with flexible circuits have taught us
invaluable know-how. We are now able to share that through
comprehensive and value-added solutions to meet customer
objectives.
To achieve our goal of
worldwide manufacturing and service, we have set up factories and
offices in North America, Europe, China, Japan, Korea, H.K. and
Singapore. Our newest facilities located just outside of Shanghai,
came on line in early 2000 and specializes in high volume single
and double sided FPCs. Capabilities at our headquarters in Taiwan
have been added to include fine line etching to accommodate chip
on flex(COF) applications. Our worldwide facilities and cutting
edge technologies ensure our customers of highest quality
products, supplied with superior service at the most competitive
prices.
Flexible
Printed Circuits Enquiry Form
| Company
Information |
| Registered
Capital: |
US$15,000,000 |
| Total
Factory Area: |
Taipei
Factory |
10,000m2 |
| China
Factory |
33,000m2 |
| Capacity(Monthly): |
|
Taipei
Factory |
China
Factory |
| Single
Sided FPC |
30,000m2 |
20,000m2 |
| Double
Sided FPC |
20,000m2 |
15,000m2 |
| Multi-layered
& Window Type FPC |
10,000m2 |
8,000m2 |
| Average
Leadtime: |
7-14
days for samples |
| 2-5
weeks for mass production |
| Employees: |
|
Taipei
Factory |
China
Factory |
| Management |
10 |
8 |
| Administrative |
32 |
15 |
| Engineering |
42 |
12 |
| Q.A |
35 |
15 |
| Operator |
420 |
400 |
Product
Applications
Technical
Specification of Selectronic FPC
| Materials |
Polymide (PI) |
Polyester
(PET) |
Remark & Test Method |
| Number of Layer |
1~6 (Rigid-Flex&Multilayers
FPC) |
1~2 |
|
| Min.Track Width/Spacing |
COF |
0.0254mm (1 mils) |
--- |
|
| Single Sided |
0.050mm (2mils) |
|
| Double Sided |
0.075mm~0.100mm (3~4 mils) |
|
| Min.Hole Diameter |
Drilling
(P.T.H) |
Ø0.27mm
|
|
| Punching |
Ø0.50mm
|
|
Dimension
Tolerances |
Conductor Width (W) |
±0.025mm |
W 0.125mm |
| Hole Diameter (H) |
±0.05mm(With
P.T.H. ±0.10mm) |
H1.5mm |
| Accumulated Pitch (P) |
±0.05mm(Special
±0.03mm) |
P25mm |
| Outline Dimension (L) |
±0.1mm |
|
| Conductors and Outline (C) |
±0.1mm
(Special ±0.7mm) |
base
on ZIF spec. |
| Conductors and Coverlay |
±0.3~0.5mm) |
|
| Surface
Treatment on Terminal and Land Areas |
Soft
or Hard Ni / Au (Au:0.05~1.25µm)
Sn/Pb (2~20µm) Primary Flux
Carbon Printed (4~10µm / Less Than 5 )
H.A.L. (For Polymide Only) |
|
| Insulation
Resistance |
1000M |
IPC-TM-650
2,6,3,2 at Ambient |
| Dielectric
Strength |
5KV |
IPC-TM-650
2, 5, 6, 1 |
| Surface
Resistance () |
5x10^12 |
5x10^15 |
IPC-TM-650
2, 5, 17 |
| Volume
Resistivity (
-cm) |
1x10^15 |
1x10^15 |
IPC-TM-650
2, 5, 17 |
| Dielectric
Constant (1MHz) |
4.0 |
3.0 |
MIL-P-55617 |
| Dissipation
Factor (1MHz) |
0.04 |
0.03 |
MIL-P-55617 |
| Peeling
Strength (180°) |
1.0
kgf / cm |
1.2kgf/
cm |
PC-TM-650
2, 4, 9 |
| Solder
heat Resistance |
300°C
/ 10 secs |
210°C
/ 3 secs |
|
| Flammability |
94
V-0 |
94
VTM-0 |
UL94 |
| Water
Absorption |
2.9% |
<0.8% |
ASTM
D570 % (24 Hours) |
Flexible
Printed Circuits Enquiry Form
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|
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For more
information on Flexible Printed Circuits please call +44 (0) 1993
778 000 or click here to
complete our online enquiry form. |
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